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Code of Federal Regulations (Last Updated: May 6, 2024) |
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Title 15 - Commerce and Foreign Trade |
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Subtitle B—Regulations Relating to Commerce and Foreign Trade |
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Chapter II—National Institute of Standards and Technology, Department of Commerce |
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SubChapter C—Chips Program |
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Part 231 - Clawbacks of Chips Funding |
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Subpart A - Definitions |
§ 231.108 - Material expansion.
Latest version.
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§ 231.108 Material expansion.
Material expansion means:
an existing(1) with respect to an existing facility, the increase of the semiconductor manufacturing capacity of
that facility by more than five percent of the capacity memorialized in the required agreement due to the addition of a cleanroom, production line or other physical space, or a series of such additions; or
(2) any construction of a new facility for semiconductor manufacturing.
[88 FR 89574, Dec. 28, 2023]