Table 1-3 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes  


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  • Pt. 98, Subpt. I, Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer SizesProcess
  • type/sub-type
  • Process gas iCF4C2F6CHF3CH2F2C2HF5CH3FC3F8C4F8NF3SF6C4F6C5F8C4F8OEtching/Wafer Cleaning1-Ui0.810.720.510.130.0640.70NA0.140.190.550.170.072NABCF4NA0.100.0850.0790.077NANA0.110.00400.130.13NANABC2F60.046NA0.0300.0250.0240.0034NA0.0370.0250.110.110.014NABC4F6NANANANANANANANANANANANANABC4F8NANANANANANANANANANANANANABC3F8NANANANANANANANANANANANANABC5F80.0012NA0.0012NANANANA0.0086NANANANANABCHF30.100.047NA0.049NANANA0.040NA0.00120.0660.0039NAChamber CleaningIn situ plasma cleaning:1-Ui0.920.55NANANANA0.400.100.18NANANA0.14BCF4NA0.21NANANANA0.200.110.050NANANA0.13BC2F6NANANANANANANANANANANANA0.045BC3F8NANANANANANANANANANANANANARemote plasma cleaning:1-UiNANANANANANANANA0.017NANANANABCF4NANANANANANANANA0.015NANANANABC2F6NANANANANANANANANANANANANABC3F8NANANANANANANANANANANANANAIn situ thermal cleaning:1-UiNANANANANANANANANANANANANABCF4NANANANANANANANANANANANANABC2F6NANANANANANANANANANANANANABC3F8NANANANANANANANANANANANANANotes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.