Table I-4 to Subpart I of Part 98 - — Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size

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Table I-4 to Subpart I of Part 98 - Default Emission Factors (1-U_ij) for Gas Utilization Rates (U_ij) and By-Product Formation Rates (B_ijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size

Table I-4 to Subpart I of Part 98 - Default Emission Factors (1-U_ij) for Gas Utilization Rates (U_ij) and By-Product Formation Rates (B_ijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size

Process type/sub-type	Process gas i
Process type/sub-type	CF₄	C₂F₆	CHF₃	CH₂F₂	CH₃F	C₃F₈	C₄F₈	NF₃	SF₆	C₄F₆	C₅F₈	C₄F₈O
Etching/Wafer Cleaning
1-U_i	0.65	0.80	0.42	0.21	0.33	0.30	0.18	0.15	0.32	0.15	0.10	NA
BCF₄	NA	0.21	0.095	0.049	0.045	0.21	0.045	0.046	0.040	0.059	0.11	NA
BC₂F₆	0.079	NA	0.064	0.052	0.00087	0.18	0.031	0.045	0.044	0.074	0.083	NA
BC₄F₆	NA	NA	0.00010	NA	NA	NA	0.018	NA	NA	NA	NA	NA
BC₄F₈	0.00063	NA	0.00080	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₃F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	0.00012	NA
BCHF₃	0.011	NA	NA	0.050	0.0057	0.012	0.027	0.025	0.0037	0.019	0.0069	NA
BCH₂F₂	NA	NA	0.0036	NA	0.0023	NA	0.0015	0.00086	0.000029	0.000030	NA	NA
BCH₃F	0.0080	NA	0.0080	0.0080	NA	0.00073	NA	0.0080	NA	NA	NA	NA
Chamber Cleaning
In situ plasma cleaning:
1-U_i	NA	NA	NA	NA	NA	NA	NA	0.23	NA	NA	NA	NA
BCF₄	NA	NA	NA	NA	NA	NA	NA	0.037	NA	NA	NA	NA
BC₂F₆	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₃F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
Remote Plasma Cleaning:
1-U_i	NA	NA	NA	NA	NA	0.063	NA	0.017	NA	NA	NA	NA
BCF₄	NA	NA	NA	NA	NA	NA	NA	0.075	NA	NA	NA	NA
BC₂F₆	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₃F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
In Situ Thermal Cleaning:
1-U_i	NA	NA	NA	NA	NA	NA	NA	0.28	NA	NA	NA	NA
BCF₄	NA	NA	NA	NA	NA	NA	NA	0.010	NA	NA	NA	NA
BC₂F₆	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₃F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA

[81 FR 89256, Dec. 9, 2016]

                    
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Table I-4 to Subpart I of Part 98 - — Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size

Table I-4 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size

Table I-4 to Subpart I of Part 98 - Default Emission Factors (1-U_ij) for Gas Utilization Rates (U_ij) and By-Product Formation Rates (B_ijk) for Semiconductor Manufacturing for 300 mm and 450 mm Wafer Size