Table I-5 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing

Table I-5 to Subpart I of Part 98 - Default Emission Factors (1-U_ij) for Gas Utilization Rates (U_ij) and By-Product Formation Rates (B_ijk) for MEMS Manufacturing

Process type factors	Process gas i
	CF4	C2F6	CHF3	CH2F2	C3F8	c− C4F8	NF3 Remote	NF3	SF6	C4F6a	C5F8a	C4F8Oa
Etch 1-Ui	0.7	10.4	10.4	10.06	NA	10.2	NA	0.2	0.2	0.1	0.2	NA
Etch BCF4	NA	10.4	10.07	10.08	NA	0.2	NA	NA	NA	10.3	0.2	NA
Etch BC2F6	NA	NA	NA	NA	NA	0.2	NA	NA	NA	10.2	0.2	NA
CVD Chamber Cleaning 1-Ui	0.9	0.6	NA	NA	0.4	0.1	0.02	0.2	NA	NA	0.1	0.1
CVD Chamber Cleaning BCF4	NA	0.1	NA	NA	0.1	0.1	20.02	20.1	NA	NA	0.1	0.1
CVD Chamber Cleaning BC3F8	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	0.4

Notes: NA = Not applicable; i.e., there are no applicable default emission factor measurements for this gas. This does not necessarily imply that a particular gas is not used in or emitted from a particular process sub-type or process type.

¹ Estimate includes multi-gas etch processes.

² Estimate reflects presence of low-k, carbide and multi-gas etch processes that may contain a C-containing fluorinated GHG additive.

[75 FR 74818, Dec. 1, 2010, as amended at 78 FR 68225, Nov. 13, 2013]