Part 413 - Electroplating Point Source Category  


Subpart A - Electroplating of Common Metals Subcategory
§ 413.10 - Applicability: Description of the electroplating of common metals subcategory.
§ 413.11 - Specialized definitions.
§ 413.14 - Pretreatment standards for existing sources.
§§ 413.12--413.13 - [Reserved]
Subpart B - Electroplating of Precious Metals Subcategory
§ 413.20 - Applicability: Description of the electroplating of precious metals subcategory.
§ 413.21 - Specialized definitions.
§ 413.24 - Pretreatment standards for existing sources.
§§ 413.22--413.23 - [Reserved]
Subpart C - Electroplating of Speciality Metals Subcategory
Subpart D - Anodizing Subcategory
§ 413.40 - Applicability: Description of the anodizing subcategory.
§ 413.41 - Specialized definitions.
§ 413.44 - Pretreatment standards for existing sources.
§§ 413.42--413.43 - [Reserved]
Subpart E - Coatings Subcategory
§ 413.50 - Applicability: Description of the coatings subcategory.
§ 413.51 - Specialized definitions.
§ 413.54 - Pretreatment standards for existing sources.
§§ 413.52--413.53 - [Reserved]
Subpart F - Chemical Etching and Milling Subcategory
§ 413.60 - Applicability: Description of the chemical etching and milling subcategory.
§ 413.61 - Specialized definitions.
§ 413.64 - Pretreatment standards for existing sources.
§§ 413.62--413.63 - [Reserved]
Subpart G - Electroless Plating Subcategory
§ 413.70 - Applicability: Description of the electroless plating subcategory.
§ 413.71 - Specialized definitions.
§ 413.74 - Pretreatment standards for existing sources.
§§ 413.72--413.73 - [Reserved]
Subpart H - Printed Circuit Board Subcategory
§ 413.80 - Applicability: Description of the printed circuit board subcategory.
§ 413.81 - Specialized definitions.
§ 413.84 - Pretreatment standards for existing sources.
§§ 413.82--413.83 - [Reserved]
General Provisions
§ 413.01 - Applicability and compliance dates.
§ 413.02 - General definitions.
§ 413.03 - Monitoring requirements.
§ 413.04 - Standards for integrated facilities.