Code of Federal Regulations (Last Updated: November 8, 2024) |
Title 40 - Protection of Environment |
Chapter I - Environmental Protection Agency |
SubChapter C - Air Programs |
Part 98 - Mandatory Greenhouse Gas Reporting |
Subpart I - Electronics Manufacturing |
§ 98.90 - Definition of the source category. |
§ 98.91 - Reporting threshold. |
§ 98.92 - GHGs to report. |
§ 98.93 - Calculating GHG emissions. |
§ 98.94 - Monitoring and QA/QC requirements. |
§ 98.95 - Procedures for estimating missing data. |
§ 98.96 - Data reporting requirements. |
§ 98.97 - Records that must be retained. |
§ 98.98 - Definitions. |
Table I-1 to Subpart I - Default Emission Factors for Threshold Applicability Determination |
Table I-2 to Subpart I - Examples of Fluorinated GHGs and Fluorinated Heat Transfer Fluids Used by the Electronics Industry |
Table I-8 to Subpart I - Table I-8 to Subpart I of Part 98-Table I-8 to Subpart I of Part 98 - Default Emission Factors (1-UN2O j) for N2O Utilization (UN2O j) |
Table I-1 to Subpart I of Part 98 - —Default Emission Factors for Threshold Applicability Determination |
Table I-10 to Subpart I of Part 98 - Maximum Field Detection Limits Applicable to Fluorinated GHG Concentration Measurements for Stack Systems |
Table I-13 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing for Use With the Stack Test Method |
Table I-14 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing for Use With the Stack Test Method |
Table I-15 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing for Use With the Stack Test Method |
Table I-16 to Subpart I of Part 98 - —Default Emission Destruction or Removal Efficiency (DRE) Factors for Electronics Manufacturing |
Table I-17 to Subpart I of Part 98 - —Expected and Possible By-Products for Electronics Manufacturing |
Table I-2 to Subpart I of Part 98 - —Examples of Fluorinated GHGs Used by the Electronics Industry |
Table I-5 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for MEMS Manufacturing |
Table I-6 to Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for LCD Manufacturing |
Table I-8 to Subpart I of Part 98 - — Default Emission Factors (1-UN2O,j) for N2O Utilization (UN2O,j) |
Table I-9 to Subpart I of Part 98 - Methods and Procedures for Conducting Emissions Test for Stack Systems |
Table I-18 to Subpart I of Part 98 - XXX |
Table I-19 to Subpart I of Part 98 - XXX |
Table I-20 to Subpart I of Part 98 - XXX |
Table I-21 to Subpart I of Part 98 - XXX |
Table I-7 To Subpart I of Part 98 - Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for PV Manufacturing |
Appendix A to Subpart I of Part 98 - Alternative Procedures for Measuring Point-of-Use Abatement Device Destruction or Removal Efficiency |