94-14520. Extension of Existing Interim Orders Granting Protection Under the Semiconductor Chip Protection Act of 1984 for Nationals, Domiciliaries and Sovereign Authorities of Certain Countries To Which Interim Protection Has Been Extended  

  • [Federal Register Volume 59, Number 114 (Wednesday, June 15, 1994)]
    [Unknown Section]
    [Page 0]
    From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
    [FR Doc No: 94-14520]
    
    
    [[Page Unknown]]
    
    [Federal Register: June 15, 1994]
    
    
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    AGENCY FOR INTERNATIONAL DEVELOPMENT
    Patent and Trademark Office
    
     
    
    Extension of Existing Interim Orders Granting Protection Under 
    the Semiconductor Chip Protection Act of 1984 for Nationals, 
    Domiciliaries and Sovereign Authorities of Certain Countries To Which 
    Interim Protection Has Been Extended
    
    agency: Patent and Trademark Office, Commerce.
    
    action: Notice.
    
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    summary: Pursuant to section 914 of the Semiconductor Chip Protection 
    Act of 1984 (SCPA), 17 U.S.C. 914, and the guidelines issued by the 
    Patent and Trademark Office, 49 FR 44517 (Nov. 7, 1984), the Assistant 
    Secretary of Commerce and Commissioner of Patents and Trademarks has 
    determined that existing interim orders under which protection under 
    the SCPA is made available to foreign mask work owners should be 
    extended in duration for nationals, domiciliaries and sovereign 
    authorities of Japan, Sweden, Australia, the Member States of the 
    European Community, Canada, Switzerland, Finland, and Austria under 
    section 914 of the SCPA.
    
    effective date: This order is effective on June 30, 1994.
    
    termination date: This order will terminate on July 1, 1995.
    
    addresses: Address correspondence to Michael S. Keplinger, Office of 
    Legislative and International Affairs, United States Patent and 
    Trademark Office, Box 4, Washington, DC 20231.
    
    for further information contact: Michael S. Keplinger, Office of 
    Legislative and International Affairs, United States Patent and 
    Trademark Office, Box 4, Washington, DC 20231, phone (703) 305-9300.
    
    supplementary information: When Congress enacted the Semiconductor Chip 
    Protection Act of 1984 (SCPA), it established an entirely new category 
    of intellectual property that did not fall under the Paris Convention 
    for the Protection of Industrial Property, the Universal Copyright 
    Convention of the Berne Convention for the Protection of Literary and 
    Artistic Works. The Congress created a balanced intellectual property 
    regime for the protection of layout-designs of semiconductor chips that 
    provided a level of protection that was satisfactory to meet the needs 
    of the U.S. public and the domestic semiconductor chip industry. At the 
    same time, Congress was also aware of the need of U.S. chip producers 
    for protection in foreign markets, of the need of foreign chip 
    producers for protection here in the United States and that there was 
    no international treaty for the protection of chips. Faced with this 
    dilemma, Congress created an innovative mechanism to encourage the 
    rapid building of a worldwide consensus on an appropriate regime of 
    intellectual property protection for chip layout-designs that would be 
    compatible with U.S. law and would encourage the development of the 
    international market for semiconductor chip products. To achieve these 
    goals, Congress established a two-tiered system for protecting foreign 
    works in the United States. Section 914 of the CPA permits the 
    Secretary of Commerce to extend interim access to protection under the 
    CPA for foreign chip creators if certain criteria are met, and section 
    902 permits the President to proclaim indefinite access to protection 
    under the SCPA for foreign creators from countries that protect U.S. 
    works. This system has laid the groundwork for establishing a 
    technology-specific, carefully tailored and balanced regime of mask 
    work protection in other chip-producing countries.
        Section 902 of the SCPA sets out the criteria under which foreign 
    works are eligible for protection in the United States. Section 
    902(a)(1) provides generally that a mask work fixed in a semiconductor 
    chip product, by or under the authority of the owner of the mask work, 
    may be protected under the SCPA if certain criteria are met.
        The first of these is that when registration is sought or the mask 
    work is first commercially exploited anywhere in the world, the owner 
    of the mask work is (1) a U.S. national or domiciliary, (2) a national, 
    domiciliary or authority of a foreign country that belongs to a treaty 
    to which the United States also belongs that protects mask works, or 
    (3) a stateless person regardless of where that person may be 
    domiciled. Protection is also available if the mask work is first 
    commercially exploited in the United States, or when the mask work 
    comes within the scope of a Presidential proclamation issued under the 
    SCPA.
        The SCPA sets out the statutory criteria against which foreign laws 
    are to be evaluated before issuing a Presidential proclamation. It 
    provides substantially that when the President concludes that a foreign 
    country grants U.S. mask work owners protection substantially the same 
    protection that it grants its own nationals and domiciliaries, or on 
    substantially the same basis as under the SCPA, the President may 
    extend protection under this chapter to mask works of owners who are 
    nationals, domiciliaries, or authorities of that country, or to mask 
    works which are first commercially exploited in that country.
        In 1987 the Chairman of the then House Subcommittee on Courts, 
    Civil Liberties and the Administration of Justice noted that the 
    transition provisions in section 914 of the SCPA were ``intended to 
    encourage the rapid development of a new worldwide regime for the 
    protection of semiconductor chips.'' 133 Cong. Rec. E1283 (daily ed. 
    April 6, 1987). These transitional provisions empowered the Executive 
    to use the issuance of interim protection orders under section 914 of 
    the SCPA as a means to encourage other nations to move speedily to 
    establish substantially similar systems of protection These provisions 
    originally were set to expire three years after the date of the 
    enactment of the SCPA, November 7, 1987.
        The Congress has twice extended the authority to issue interim 
    orders in the belief that this process is promoting the protection of 
    U.S. mask works abroad and that the speedy enactment of laws in other 
    countries that are patterned after U.S. law is progress. H.R. Rep. 100-
    388, 100th Cong., 1st Sess. (1987). Under the SCPA, the Assistant 
    Secretary of Commerce and Commissioner of Patents and Trademarks has 
    been delegated the tasks of determining when and under what conditions 
    foreign mask works will be eligible for interim protection. To become 
    eligible, a foreign government must demonstrate that it is making good 
    faith efforts toward establishing a regime of protection in its 
    territory that is substantially similar to that which is provided in 
    the United States under the SCPA.
        The countries to which interim protection has been extended (the 
    Member States of the European Community, Australia, Austria, Canada, 
    Finland, Japan, Sweden, and Switzerland) cooperated with the United 
    States to try to establish a treaty for the adequate and effective 
    protection of mask works in the World Intellectual Property 
    Organization (WIPO). A Diplomatic Conference for the negotiation of a 
    Treaty on the Protection of the Layout-Designs of Integrated Circuits 
    (IPIC Treaty) was held in Washington during the month of May 1989. The 
    IPIC Treaty adopted at the conclusion of the Conference did not meet 
    the needs of either Japan or the United States. No developed country 
    has thus far signed the Treaty, and it is yet to come into force.
        Subsequent to the Diplomatic Conference, the United States has 
    continued to work to conclude a multilateral agreement for the adequate 
    and effective protection of semiconductor integrated circuit layout-
    designs. The Agreement on the Trade Related Aspects of Intellectual 
    Property (TRIPs) that was adopted on December 15, 1993, in the Uruguay 
    Round of Trade negotiations in the General Agreement on Tariffs and 
    Trade contains a section that will require such protection. It builds 
    upon the substantive provisions of the IPIC Treaty and adds the missing 
    features deemed necessary to provide an adequate level of protection. 
    It permits compulsory licensing of semiconductor technology only for 
    public non-commercial uses or to remedy an adjudicated antitrust 
    violation, it requires innocent infringers to pay reasonable royalties 
    after notice, and it provides that products that include infringing 
    chips fall within its scope of protection. Thus the TRIPs Agreement 
    provides the level of protection in an internationally recognized text 
    that is fully consistent with the U.S. SCPA and meets, or exceeds, the 
    levels of protection provided in other countries' chip protection laws. 
    The countries to which interim protection has been extended to all 
    worked closely with the United States to achieve this goal. However, 
    the TRIPs Agreement has not yet been implemented by the United States, 
    and the presently issued interim orders will expire on July 1, 1994, 
    before the implementation of the TRIPs agreement.
        The combination of the standards set out in section 902 and the 
    process established to implement section 914 clearly appear to have 
    satisfied the Congressional intent behind this unprecedented process. 
    In 1984, only the United States had specific legislation in place for 
    the protection of chips, while today such protection is in place in all 
    of the countries to which interim protection has been extended. U.S. 
    semiconductor chip layout-designs enjoy protection in all of those 
    countries today. In some, the protection is enjoyed on the basis of 
    national treatment and in some on the basis of reciprocity.
        Since the interim orders were last extended, no complaints about 
    the adequacy of the mask work protection laws in any of the countries 
    to which interim protection has been extended have been received. 
    Should such complaints arise in the future, they can be taken into 
    account in determining whether a particular interim order should be 
    rescinded prior to its scheduled termination.
        Because of this favorable environment, and in order to ensure the 
    continuing protection of U.S. layout-designs in foreign markets, I have 
    determined that extending the present interim orders will provide the 
    time needed for the final implementation of the TRIPs Agreement which 
    will provide the basis for an adequate and effective muiltinational 
    system for the protection for semiconductor mask works. In light of 
    this, I am extending the interim orders for Japan, Sweden, Australia, 
    the Member States of the European Community, Canada, Switzerland. 
    Finland and Austria under Section 914 of the SCPA. These orders will 
    expire on July 1, 1995.
    
        Dated: May 26, 1994.
    Bruce A. Lehman,
    Assistant Secretary of Commerce and Commissioner of Patents and 
    Trademarks.
    [FR Doc. 94-14520 Filed 6-14-94; 8:45 am]
    BILLING CODE 3510-16-M
    
    
    

Document Information

Effective Date:
6/30/1994
Published:
06/15/1994
Department:
Patent and Trademark Office
Entry Type:
Uncategorized Document
Action:
Notice.
Document Number:
94-14520
Dates:
This order is effective on June 30, 1994.
Pages:
0-0 (1 pages)
Docket Numbers:
Federal Register: June 15, 1994