99-22189. Proposed Administrative Agreement for Collection of CERCLA Past and Projected Clean Up Costs  

  • [Federal Register Volume 64, Number 165 (Thursday, August 26, 1999)]
    [Notices]
    [Pages 46681-46682]
    From the Federal Register Online via the Government Publishing Office [www.gpo.gov]
    [FR Doc No: 99-22189]
    
    
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    ENVIRONMENTAL PROTECTION AGENCY
    
    [FRL-6429-1]
    
    
    Proposed Administrative Agreement for Collection of CERCLA Past 
    and Projected Clean Up Costs
    
    AGENCY: Environmental Protection Agency (U.S. EPA).
    
    ACTION: Notice; proposed CERCLA 122 administrative agreement.
    
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    SUMMARY: U.S. EPA is proposing to execute an Administrative Agreement 
    (Agreement) under section 122 of CERCLA for collection of a percentage 
    of past and projected future response costs at the Carey Electronics 
    Superfund Site. Respondents have agreed to pay $235,000 out of total 
    past and projected clean up costs of approximately $292,000, in return 
    for a covenant not to sue and mutual contribution protection from U.S. 
    EPA and one another. U.S. EPA today is proposing to execute this 
    Agreement because it achieves collection of a high percentage (80.5%) 
    of total Site costs.
    
    DATES: Comments on this proposed settlement must be received on or 
    before September 27, 1999.
    
    ADDRESSES: Copies of the proposed settlement are available at the 
    following address for review: (it is recommended that you telephone Ms. 
    Cheryl Allen at (312) 353-6196 before visiting the Region V Office) Ms. 
    Cheryl Allen, OPA (P19-J), Coordinator, Office of Public Affairs, U.S. 
    Environmental Protection Agency, Region V, 77 W. Jackson Boulevard (P-
    19J), Chicago, Illinois 60604, (312) 353-6196.
        Comments on this proposed settlement should be addressed to: 
    (please submit an original and three copies, if possible) Ms. Cheryl 
    Allen, Coordinator, Office of Public Affairs, U.S. Environmental 
    Protection Agency, Region V, 77 W. Jackson Boulevard (P-
    
    [[Page 46682]]
    
    19J), Chicago, Illinois 60604, (312) 353-6196.
    
    FOR FURTHER INFORMATION CONTACT: Ms. Cheryl Allen, Office of Public 
    Affairs, at (312) 353-6196.
    
    SUPPLEMENTARY INFORMATION: The Site is a multi-level building located 
    at 1880 Clifton Avenue in Springfield, Clark County, Ohio. The Site is 
    surrounded on all sides by residential areas, with an elementary school 
    located approximately 1,200 feet to the north. (Additionally, there are 
    5 other schools located within a 1-mile radius of the Site.) The Carey 
    Electronic Engineering Company still utilizes the basement area of the 
    Site to produce aluminum and copper wool scrubbing and filter products, 
    primarily for use in aviation. The laboratory area of the Site, that 
    contains post-source removal radium (Ra-226) contamination and 
    improperly stored chemicals of concern, is on the second floor of the 
    Site building. Portions of the hallway leading to the laboratory and 
    the stairway leading to the hallway have also been determined to have 
    radioactive contamination.
        A 30-day period, beginning on the date of publication, is open 
    pursuant to section 122(I) of CERCLA for comments on the proposed 
    Administrative Agreement.
        Comments should be sent to Ms. Cheryl Allen of the Office of Public 
    Affairs (P-19J), U.S. Environmental Protection Agency, Region V, 77 W. 
    Jackson Boulevard, Chicago, Illinois 60604.
    William E. Muno,
    Director, Superfund Division, Region 5.
    [FR Doc. 99-22189 Filed 8-25-99; 8:45 am]
    BILLING CODE 6560-50-M
    
    
    

Document Information

Published:
08/26/1999
Department:
Environmental Protection Agency
Entry Type:
Notice
Action:
Notice; proposed CERCLA 122 administrative agreement.
Document Number:
99-22189
Dates:
Comments on this proposed settlement must be received on or before September 27, 1999.
Pages:
46681-46682 (2 pages)
Docket Numbers:
FRL-6429-1
PDF File:
99-22189.pdf