Table I-3 to Subpart I of Part 98 - —Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

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Table I-3 to Subpart I of Part 98—Default Emission Factors (1-U_ij) for Gas Utilization Rates (U_ij) and By-Product Formation Rates (B_ijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-U_ij) for Gas Utilization Rates (U_ij) and By-Product Formation Rates (B_ijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Process type/sub-type	Process gas i
Process type/sub-type	CF₄	C₂F₆	CHF₃	CH₂F₂	C₂HF₅	CH₃F	C₃F₈	C₄F₈	NF₃	SF₆	C₄F₆	C₅F₈	C₄F₈O
Etching/Wafer Cleaning
1-U_i	0.81	0.72	0.51	0.13	0.064	0.70	NA	0.14	0.19	0.55	0.17	0.072	NA
BCF₄	NA	0.10	0.085	0.079	0.077	NA	NA	0.11	0.0040	0.13	0.13	NA	NA
BC₂F₆	0.046	NA	0.030	0.025	0.024	0.0034	NA	0.037	0.025	0.11	0.11	0.014	NA
BC₄F₆	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₄F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₃F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₅F₈	0.0012	NA	0.0012	NA	NA	NA	NA	0.0086	NA	NA	NA	NA	NA
BCHF₃	0.10	0.047	NA	0.049	NA	NA	NA	0.040	NA	0.0012	0.066	0.0039	NA
Chamber Cleaning
In situ plasma cleaning:
1-U_i	0.92	0.55	NA	NA	NA	NA	0.40	0.10	0.18	NA	NA	NA	0.14
BCF₄	NA	0.21	NA	NA	NA	NA	0.20	0.11	0.050	NA	NA	NA	0.13
BC₂F₆	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	0.045
BC₃F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
Remote plasma cleaning:
1-U_i	NA	NA	NA	NA	NA	NA	NA	NA	0.017	NA	NA	NA	NA
BCF₄	NA	NA	NA	NA	NA	NA	NA	NA	0.015	NA	NA	NA	NA
BC₂F₆	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₃F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
In situ thermal cleaning:
1-U_i	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BCF₄	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₂F₆	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA
BC₃F₈	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA	NA

[81 FR 9255, Dec. 9, 2016]

                    
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Table I-3 to Subpart I of Part 98 - —Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-Uij) for Gas Utilization Rates (Uij) and By-Product Formation Rates (Bijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes

Cross Reference

Table I-3 to Subpart I of Part 98—Default Emission Factors (1-U_ij) for Gas Utilization Rates (U_ij) and By-Product Formation Rates (B_ijk) for Semiconductor Manufacturing for 150 mm and 200 mm Wafer Sizes